2022 Frontier Interdisciplinary Forum for Advanced Functional Materials and Devices was Successfully Held

时间:2022-12-09浏览:26

In November 2022, Frontier Interdisciplinary Forum for Advanced Functional Materials and Devices with 32 online keynotes was successfully held. This forum focused on the science and engineering technology issues in the field of advanced materials and devices. Some hot topics were deeply discussed, including the advanced technologyanddevicesofintegrated circuits, topological quantum and superconducting magnetic devices, advanced functional materials and devices plus the frontier views of semiconductor materials and devices from industry. Wonderful presentations were given by 32 leading scientists to the participating teachers and students, which were hosted by Prof. Luo Feng from the School of Materials Science and Engineering.

 

At the forum of advanced technology and devices of integrated circuits, scientists made systematic and in-depth reports about Gate-All-Around devices, 3D DRAM, 3D NAND Flash, new materials and technology for sub-3 nm lithography, the key techniques and equipment for integrated circuits fabrication and measurement, and the design and application of radio frequency chip. At the forum of topological quantum and superconducting magnetic devices, scientists shared their recent works in the fields of quantum topological devices, superconducting quantum devices, ferromagnetic semiconductor materials and devices, optical quantum measurement and quantum computation. At the forum of advanced functional materials and devices, the experts have systematically concluded the compound semiconductor materials, flexible semiconductor material, and ferroelectric semiconductor materials and devices. Additionally, they discussed the latest progress in those areas. Moreover, at the forum of the frontier views of semiconductor materials and devices from industry, the CEOs and CTOs analyzed the industry and technology trends of automotive grade chips, DRAM devices and chips, nanoimprint lithography, silicon photonics technology, reliability and expiration analysis of high-end chips. Besides, they also made forecasts of the future market with their heightened awareness.

 

Identifying advanced mainstream idea and technical requirements, this forum had not only broadened international horizon of the teachers and students, but also introduced the latest technological progress in China. It was also conducive to promoting the development of the material science and engineeringof our university and strengthening the internal communication with physics, optics, IT and chemistry.